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datashee t product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays . 1/32 tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ?14 ? 001 www.rohm.com 23.jan.2014 rev.001 gate driver providing galvanic isolation series isolation voltage 2500vrms 1ch gate driver providing galvanic isolation BM6102FV-C general description the BM6102FV-C is a gate driver with isolation voltage 2500vrms, i/o delay time of 200ns, and minimum input pulse width of 100ns, and incorporates the fault signal output functions, undervoltage lockout (uvlo) function, thermal protection function, an d short current protection (scp, desat) function. features providing galvanic isolation active miller clamping fault signal output function (adjustable output holding time) undervoltage lockout function thermal protection function (adjustable threshold voltage) short current protection function (adjustable threshold voltage) soft turn-off function for short current protection aec-q100 qualified key specifications isolation voltage: maximum gate drive voltage: i/o delay time: minimum input pulse width: 2500 [vrms] (min) 20 [v] (max) 200 [ns] (max) 100 [ns] (max) package w(typ) x d(typ) x h(max) ssop-b20w 6.50 L 8.10 L2.01 L applications automotive isolated igbt/mosfet inverter gate drive automotive dc-dc converter industrial inverters systems ups systems typical application circuits figure 1. for using 4-pin igbt (for using scp function) figure 2. for using 3-pin igbt (for using desat function) r flt rls c flt rls out1 vtsin nc gnd1 gnd1 ina timer timer uvlo fltrls vcc1 test gnd2 mask out2 scpin flt vcc2 logic s r q proout gnd2 pre driver mask mask mask fb c vcc1 c vcc2 flt ena ecu inb vtsth mask logic mask flt sens or uvlo scpth - + r flt rls c flt rls out1 vtsin nc gnd1 gnd1 ina timer timer uvlo fltrls vcc1 test gnd2 out2 scpin vcc2 logic s r q proout gnd2 mask fb c vcc1 c vcc2 flt ena ecu inb vtsth mask logic mask flt sens or scpth mask flt mask mask uvlo pre driver - +
2/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 recommended range of external constants pin name symbol recommended value unit min. typ. max. fltrls c fltrls - 0.01 0.47 f r fltrls 50 200 1000 k vcc1 c vcc1 0.1 1.0 - f vcc2 c vcc2 0.33 - - f pin configuration pin description pin no. pin name function 1 vtsin thermal detection pin 2 gnd2 output-side ground pin 3 vtsth thermal detection threshold setting pin 4 scpth short current detection threshold setting pin 5 scpin short current detection pin 6 out2 mos fet control pin for miller clamp 7 vcc2 output-side power supply pin 8 out1 output pin 9 gnd2 output-side ground pin 10 proout soft turn-off pin 11 gnd1 input-side ground pin 12 nc no connect 13 inb invert / non-invert selection pin 14 fltrls fault output holding time setting pin 15 vcc1 input-side power supply pin 16 flt fault output pin 17 ina control input pin 18 ena input enabling signal input pin 19 test test mode setting pin 20 gnd1 input-side ground pin (top view) gnd1 vt s in 20 1 test g nd2 19 2 ena vt s th 18 3 ina sc pth 17 4 flt sc pin 16 5 vcc1 ou t2 15 6 fltrls v cc 2 14 7 inb o u t1 8 nc g nd2 12 gnd1 pr o ou t 11 10 13 9
3/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 description of pins and cautions on layout of board 1 vcc1 (input-side power supply pin) the vcc1 pin is a power supply pin on the input side. to suppress voltage fluctuations due to the current to drive internal transformers, connect a bypass capacitor between the vcc1 and the gnd1 pins. 2 gnd1 (input-side ground pin) the gnd1 pin is a ground pin on the input side. 3 vcc2 (output-side power supply pin) the vcc2 pin is a power supply pin on the output side. to reduce voltage fluctuations due to out1, out2 pin output current and due to the current to drive internal transfo rmers, connect a bypass capacitor between the vcc2 and the gnd2 pins. 4 gnd2 (output-side ground pin) the gnd2 pin is a ground pin on the out put side. connect the gnd2 pin to the emitter / source of a power device. 5 in (control input terminal) the in pin is a pin used to determine output logic. ena inb ina out1 l x x l h l l l h l h h h h l h h h h l 6 flt (fault output pin) the flt pin is an open drain pin used to output a fault signa l when a fault occurs (i.e., when the undervoltage lockout function (uvlo), short current protection function (scp) or thermal protection function is activated). this pin is i/o pin and if l voltage is externally input, the output is set to l status regardless of other input logic. consequently, be sure to connect the pull-up resistor betw een vcc1 pin and the flt pin even if this pin is not used. pin flt while in normal operation hi-z when an fault occurs (when uvlo, scp or thermal protection is activated) l 7 fltrls (fault output holding time setting pin) the fltrls pin is a pin used to make setting of time to hold a fault signal. connect a capacitor between the fltrls pin and the gnd1 pin, and a resistor between it and the vcc1 pin. the fault signal is held until the fltrls pin voltage exceeds a voltage set with the v fltrls parameter. to set holding time to 0 ms, do not connect the capacitor. short-circuiting the fltrls pin to the vcc1 pin will cause a high current to flow in the fltrls pin and, in an open state, may cause the ic to malfunction. to avoi d such trouble, be sure to connect a resistor between the fltrls and the vcc1 pins. 8 out1 (output pin) the out1 pin is a pin used to drive the gate of a power device. 9 out2 (mos fet control pin for miller clamp) the out2 pin is a pin for controlling the external mos switch for preventing increase in gate voltage due to the miller current of the power device connected to out1 pin. 10 proout (soft turn-off pin) the proout pin is a pin used to put the soft turn-off func tion of a power devise in operation when the scp function is activated. this pin combines with the gate voltage monitoring pin for miller clamp function. 11 scpin (short current detection pin), scpth (short current detection threshold setting pin) the scpin pin is a pin used to detect current for short current protection. when the scpin pin voltage exceeds a voltage set with the scpth pin voltage, the scp function will be activated. this may cause the ic to malfunction in an open state. to avoid such trouble, shor t-circuit the scpin pin to the gnd2 pin and scpth pin to the vcc2 pin if the short current protection is not used. in order to preven t the wrong detection due to noise, the noise mask time t scpmsk (typ 3.0s) is set. 12 vtsin(thermal detection pin), vtsth (thermal detection threshold setting pin) the vtsin pin is a temperature sensor voltage input pin, which can be used for thermal protection of a power device. if vtsin pin voltage becomes vtsth pin voltage or less, out1 pin is set to l. in the open status, the ic may malfunction, so be sure to supply the vtsin more than vtsth if the thermal protection function is not used. in order to prevent the wrong detection due to noise, the noise mask time t tsmsk (typ 10s) is set.
4/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 description of functions and examples of constant setting 1) miller clamp function when out1=l and proout pin voltage < v out2on (typ 2.0v), h is output from out2 pin and the external mos switch is turned on. when out1=h, l is output from out2 pin and the exte rnal mos switch is turned off. while the short-circuit protection function is activated, l is output from out2 pin and the external mos switch is turned off. short current scpin in (ina exor inb) proout out2 detected not less than v scpth x x l not detected x l not less than v out2on l x l less than v out2on h x h x l figure 3. block diagram of miller clamp function logic v out2on out2 logic logic out1 predriv er logic vcc2 proout gnd2 - + predriv er predriv er predriv er predriv er figure 4. timing chart of miller clamp function v out2on in out1 proout (monitor the gate voltage) out2 t pon (typ 150ns) t poff (typ 150ns) t out2on (typ 40ns)
5/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 2) fault status output this function is used to output a fault signal from the flt pin when an fault occurs (i.e., when the undervoltage lockout function (uvlo), short current protection function (scp) or t hermal protection function is activated) and hold the fault signal until the set fault output holding time is completed. the fault output holding time t fltrls is given as the following equation with the settings of capacitor c fltrls and resistor r fltrls connected to the fltrls pin. for example, when c fltrls is set to 0.01f and r fltrls is set to 200k ? , the holding time will be set to 2 ms. t fltrls [ms]= c fltrls [f]?r fltrls [k ? ] to set the fault output holding time to ?0? ms, only connect the resistor r fltrls . status flt pin normal hi-z fault occurs l 3) undervoltage lockout (uvlo) function the BM6102FV-C incorporates the undervoltage lockout (uvlo) function both on the low and the high voltage sides. when the power supply voltage drops to the uvlo on voltage( low voltage side typ 4.15v, high voltage side typ 11.5v), the out1 pin and the flt pin both will output the ?l? signal . when the power supply voltage rises to the uvlo off voltage(low voltage side typ 4.25v, high voltage side typ 12.5v), these pins will be reset. however, during the fault output holding time set in ?2) fault status output? section, the out1 pin and the flt pin will hold the ?l? signal. in addition, to prevent malfunctions due to noises, mask time t uvlo1msk (typ 10s) and t uvlo2msk (typ 10s) are set on both low and high voltage sides. in l h vcc2 v uvlo2h v uvlo2l flt hi-z l out1 l h hi-z figure 8. output-side uvlo operation timing chart ecu vcc1 fltrls flt gnd1 r fltrls c fltrls uvlo scp vts logic r s mask r s flt mask mask mask - - + figure 6. fault output block diagram figure 5. fault status output timing chart flt hi-z l out1 l h v fltrls fltrls fault output holding time t fltrls status fault occurs (the uvlo, scp or thermal protection function is activated.) figure 7. input-side uvlo f unction operation timing chart vcc1 v uvlo1h v uvlo1l flt hi-z l out1 l h l h in
6/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 4) short current protection function (scp, desat) when the scpin pin voltage exceeds a voltage set with the scpth pin voltage, the scp function will be activated. when the scp function is activated, the out1 pin voltage will be set to the ?hi-z? level first, and then the proout pin voltage to the ?l? level (soft turn-off).next, after t sto (min 30s, max 110s) has passed after the short-circuit current falls below the threshold value, out1 pin becomes l and proout pin becom es hi-z. finally, when the fault output holding time set in ?2) fault status output? section on page 5 is completed, the scp function will be released. v collector /v drain which desaturation protection starts operation (v desat ) and the blanking time (t blank ) can be calculated by the formula below; v desat reference value (in case of scpth=0.7v) r1 r2 r3 4.0v 15 k 39 k 6.8 k 4.5v 15 k 43 k 6.8 k 5.0v 15 k 36 k 5.1 k 5.5v 15 k 39 k 5.1 k 6.0v 15 k 43 k 5.1 k 6.5v 15 k 62 k 6.8 k 7.0v 15 k 68 k 6.8 k 7.5v 15 k 82 k 7.5 k 8.0v 15 k 91 k 8.2 k 8.5v 15 k 82 k 6.8 k 9.0v 15 k 130 k 10 k 9.5v 15 k 91 k 6.8 k 10.0v 15 k 130 k 9.1 k ?? ?? ?? 6 2 12 outernal 2 1020 3 123 1 109 3 123 12 3 123 3 23 1 ? ? ??? ?? ?????? ?? ? ?? ?? ?? ? ? ?? .) v v r rrr ln() c(r rrr rr st r rrr vvv v r rr vvv cc scpth blank blank scpth cc f scpth desat min d figure 9. block diagram for desat scpmask logic r1 r2 r3 v scpth vcc2 out1 proout scpin scpth gnd2 + - + - s r q v fltrls vcc1 fltrls flt gnd2 d1 c blank
7/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 figure 10. desat operation timing chart in a out1 out2 proout scpin flt v scpth v scpth (typ 3.25 s) t blankouternal t blankouternal t blank t blan k in a out1 out2 proout scpin flt v v t scpmsk + t comp_delay t blankouternal t blankouternal t blank t blan k t scpmsk + t comp_delay figure 11. scp operation timing chart (note 1) ?2) fault status output? section on page 5 fault output holding time (n o t e 1 ) flt proout scpin out1 in hi-z l hi-z l v scpth l hi-z h h l t sto out2 hi-z h l fault output holding time (n o t e 1 ) t sto
8/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 figure 13. block diagram for scp scpmask logic v scpth vcc2 out1 proout scpin scpth gnd2 + - vcc1 fltrls flt gnd2 + - s r q v fltrls r scp figure 12. scp operation st atus transition diagram v scpin >v scpth ye s no start out1=hi-z, out2=l, proout=l, flt=l out1=h, out2=l exceed mask time ye s no v fltrls >v tfltrls ye s no in=h ye s no v scpin 9/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 5 i/o condition table no. status input output v c c 1 v c c 2 v t s i n s c p i n f l t e n a i n b i n a p r o o u t o u t 1 o u t 2 p r o o u t f l t 1 vcc1uvlo uvlo x x l x x x x h l l hi-z l 2 uvlo x x l x x x x l l h hi-z l 3 vcc2uvlo x uvlo x l x x x x h l l hi-z l 4 x uvlo x l x x x x l l h hi-z l 5 disable h l h l x x h l l hi-z hi-z 6 h l h l x x l l h hi-z hi-z 7 flt external input h l l x x x h l l hi-z hi-z 8 h l l x x x l l h hi-z hi-z 9 scp x h x x x x x hi-z l l l 10 thermal protection l l x x x x h l l hi-z l 11 l l x x x x l l h hi-z l 12 non-invert operation l input h l h h l l h l l hi-z hi-z 13 h l h h l l l l h hi-z hi-z 14 non-invert operation h input h l h h l h x h l hi-z hi-z 15 invert operation l input h l h h h l x h l hi-z hi-z 16 invert operation h input h l h h h h h l l hi-z hi-z 17 h l h h h h l l h hi-z hi-z : vcc1 or vcc2 > uvlo, x:don't care (caution) when other errors are complicated immediately after t he scp function is activated, scp function (soft turn-off) is given to priority.
10/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 6) power supply startup / shutoff sequence figure 14. power supply startup / shutoff sequence proout h l in h l vcc2 0v vcc1 0v v uvlo1h v uvlo2l v uvlo2l v uvlo1h out1 flt hi-z l hi-z h l l out2 proout hi-z l v uvlo2h v uvlo1l v uvlo1l v uvlo2h in h l vcc2 0v flt hi-z l out1 hi-z h l vcc1 0v out2 hi-z l h : since the vcc2 pin voltage is low an d the output mos does not turn on, the output pins become hi-z conditions. : since the vcc1 pin voltage is low and the flt output mos does not turn on, the output pins become hi-z conditions. hi-z hi-z
11/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 absolute maximum ratings (note 1) relative to gnd1. (note 2) relative to gnd2. (note 3) should not exceed pd and tj=150 ? c. (note 4) derate above ta=25 ? c at a rate of 9.5mw/ ? c. mounted on a glass epoxy of 70 mm ? 70 mm ? 1.6 mm. caution : operating the ic over the absolute maxi mum ratings may damage the ic. the damage can either be a short circuit between pins o r an open circuit between pins and the internal circuitry. therefore, it is import ant to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. recommended operating conditions parameter symbol min. max. units input-side supply voltage (note 5) v cc1 4.5 5.5 v output-side positive supply voltage (note 6) v cc2 14.0 20.0 v short current detection common mode input voltage v sccm 0.0 2.5 v thermal detection common mode input voltage v tscm 0.0 3.0 v (note 5) relative to gnd1. (note 6) relative to gnd2. insulation related characteristics parameter symbol characteristic units insulation resistance (v io =500v) r s >10 9 insulation withstand voltage / 1min v iso 2500 vrms insulation test voltage / 1sec v iso 3000 vrms parameter symbol limits unit input-side supply voltage v cc1 -0.3 to +7.0 (note 1) v output-side supply voltage v cc2 -0.3 to +25.0 (note 2) v ina, inb, ena pin input voltage v in -0.3 to +vcc1+0.3 or +7.0 (note 1) v flt pin input voltage v flt -0.3 to +vcc1+0.3 or +7.0 (note 1) v fltrls pin input voltage v fltrls -0.3 to +vcc1+0.3 or +7.0 (note 1) v vtsin pin input voltage v vtsin -0.3 to +7.0 (note 2) v scpin pin input voltage v scpin -0.3 to +vcc2+0.3v or +25.0 (note 2) v vtsth pin input voltage v vtsth -0.3 to +7.0 (note 2) v scpth pin input voltage v scpth -0.3 to +vcc2+0.3v or +25.0 (note 2) v out1, proout pin output current (peak 10us) i out1peak 5.0 (note 3) a out2 pin output current (peak 10us) i out2peak 1.0 (note 3) a flt output current i flt 10 ma power dissipation p d 1.19 (note 4) w operating temperature range t opr -40 to +125 c storage temperature range t stg -55 to +150 c junction temperature t jmax +150 c
12/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 electrical characteristics unless otherwise specified t a =-40c to 125c, v cc1 =4.5v to 5.5v, v cc2 =14v to 20v parameter symbol min. typ. max. unit conditions general input side circuit current 1 i cc11 0.10 0.35 0.60 ma out1=l input side circuit current 2 i cc12 0.10 0.35 0.60 ma out1=h input side circuit current 3 i cc13 1.1 1.9 2.7 ma ina =10khz, duty=50% input side circuit current 4 i cc14 2.0 3.4 4.8 ma ina =20khz, duty=50% output side circuit current 1 i cc25 1.6 2.6 3.6 ma out1=l output side circuit current 2 i cc26 1.0 1.7 2.4 ma out1=h logic block logic high level input voltage v inh 0.7 v cc1 - v cc1 v ina, inb, ena, flt logic low level input voltage v inl 0 - 0.3 v cc1 v ina, inb, ena, flt logic pull-down resistance r ind 25 50 100 k ina, inb, ena logic input minimum pulse width t inmin - - 100 ns ina, inb ena, flt mask time t fltmsk 4 10 20 s ena, flt output out1 on resistance (source) r onh 0.7 1.8 4.0 i out1 =40ma out1 on resistance (sink) r onl 0.4 0.9 2.0 i out1 =40ma out1 maximum current i out1max 3.0 4.5 - a vcc2=15v, design assurance proout on resistance r onpro 0.4 0.9 2.0 i proout =40ma turn on time t pon 100 150 200 ns no load between out1-gnd2 turn off time t poff 100 150 200 ns no load between out1-gnd2 propagation distortion t pdist -20 0 20 ns t poff - t pon rise time t rise - 50 - ns 10nfbetween out1-gnd2 fall time t fall - 50 - ns 10nfbetween out1-gnd2 out2 on resistance (source) r on2h 5 10 20 i out2 =40ma out2 on resistance (sink) r on2l 1.7 3.5 7 i out2 =40ma out2 on threshold v out2on 1.8 2 2.2 v out2 output delay time t out2on - 40 80 ns common mode transient immunity cm 100 - - kv/s design assurance protection functions input-side uvlo off voltage v uvlo1h 4.05 4.25 4.45 v input-side uvlo on voltage v uvlo1l 3.95 4.15 4.35 v input-side uvlo mask time t uvlo1msk 2 10 30 s output-side uvlo off voltage v uvlo2h 11.5 12.5 13.5 v output-side uvlo on voltage v uvlo2l 10.5 11.5 12.5 v output-side uvlo mask time t uvlo2msk 4 10 30 s short current detection offset voltage v scdet -3.25 1.00 5.25 mv short current detection mask time t scpmsk 2.1 3.0 3.9 s scpin input voltage v scpin - 0.25 0.55 v i scpin =1ma soft turn off release time t sto 30 110 s thermal detection offset voltage v tsdet -5.50 -1.25 3.00 mv thermal detection mask time t tsmsk 4 10 30 s flt output low voltage v fltl - 0.18 0.40 v i flt =5ma fltrls threshold v tfltrls 0.64v cc1 -0.1 0.64v cc1 0.64v cc1 +0.1 v figure 15. ina-out1 timing chart 50% 50% 50% 50% 90% 10% 10% 90% t rise t fall t pon t poff ina out1
13/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 typical performance curves 0.1 0.2 0.3 0.4 0.5 0.6 4.50 4.75 5.00 5.25 5.50 vcc1 [v] icc11 [ma] 0.1 0.2 0.3 0.4 0.5 0.6 -40-200 20406080100120 ta [c] icc11 [ma] figure 16. input side circuit current (at out1=l) figure 17. input side circuit current (at out1=l) ta=125c ta=25c ta=-40c vcc1=5.5v vcc1=5.0v vcc1=4.5v 0.1 0.2 0.3 0.4 0.5 0.6 4.50 4.75 5.00 5.25 5.50 vcc1 [v] icc12 [ma] 0.1 0.2 0.3 0.4 0.5 0.6 -40-200 20406080100120 ta [c] icc12 [ma] figure 18. input side circuit current (at out1=h) figure 19. input side circuit current (at out1=h) ta=125c ta=25c ta=-40c vcc1=5.5v vcc1=5.0v vcc1=4.5v
14/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 figure 20. input side circuit current (at ina=10khz and duty=50%) figure 21. input side circuit current (at ina=10khz and duty=50%) figure 22. input side circuit current (at ina=20khz and duty=50%) figure 23. input side circuit current (at ina=20khz and duty=50%) 1.2 1.6 2.0 2.4 2.8 4.50 4.75 5.00 5.25 5.50 vcc1 [v] icc13 [ma] 1.2 1.6 2.0 2.4 2.8 -40-200 20406080100120 ta [c] icc13 [ma] 2.1 2.5 2.9 3.3 3.7 4.1 4.5 4.9 4.50 4.75 5.00 5.25 5.50 vcc1 [v] icc14 [ma] 2.1 2.5 2.9 3.3 3.7 4.1 4.5 4.9 -40-200 20406080100120 ta [c] icc14 [ma] vcc1=5.5v vcc1=5.0v vcc1=4.5v ta=125c ta=25c ta=-40c ta=125c ta=25c ta=-40c vcc1=5.5v vcc1=5.0v vcc1=4.5v
15/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 figure 24. output side circuit current (at out1=l) figure 25. output side circuit current (at out1=l) 1.6 2.0 2.4 2.8 3.2 3.6 14 16 18 20 vcc2 [v] icc25 [ma] 1.6 2.0 2.4 2.8 3.2 3.6 -40-200 20406080100120 ta [c] icc25 [ma] figure 26. output side circuit current (at out1=h) figure 27. output side circuit current (at out1=h) ta=125c ta=25c ta=-40c 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 14 16 18 20 vcc2 [v] icc26 [ma] ta=125c ta=25c ta=-40c vcc2=20v vcc2=15v vcc2=14v 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 -40-200 20406080100120 ta [c] icc26 [ma] vcc2=20v vcc2=15v vcc2=14v
16/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 figure 28. logic (ina/inb) high/low level input voltage figure 29. logic (ina/inb) high/low level input voltage at ta=25c figure 30. logic pull-down resistance figure 31. logic input minimum pulse width h pulse 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 4.50 4.75 5.00 5.25 5.50 vcc1 [v] vinh / vinl [v] h level ta=125c ta=25c ta=-40c ta=-40c ta=25c ta=125c l level 0 4 8 12 16 20 24 012345 ina [v] out1 [v] vcc1=5v 25 50 75 100 -40-200 20406080100120 ta [c] rind [k ] 0 20 40 60 80 100 -40-200 20406080100120 ta [c] tinmin [ns] vcc1=4.5v vcc1=5.0v vcc1=5.5v vcc1=4.5v vcc1=5.0v vcc1=5.5v
17/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 figure 32. logic input minimum pulse width l pulse figure 33. ena input mask time figure 34. flt input mask time figure 35. out1 on resistance (source) 0 20 40 60 80 100 -40-200 20406080100120 ta [c] tinmin [ns] 4 8 12 16 20 -40-20 0 20406080100120 ta [c] tfltmsk [s] 4 8 12 16 20 -40-20 0 20406080100120 ta [c] tfltmsk [s] 0.7 1.3 1.9 2.5 3.1 3.7 -40-200 20406080100120 ta [c] ronh [ ] vcc1=4.5v vcc1=5.0v vcc1=5.5v vcc1=5.5v vcc1=5.0v vcc1=4.5v vcc1=5.5v vcc1=5.0v vcc1=4.5v vcc2=14v vcc2=15v vcc2=20v
18/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 100 120 140 160 180 200 -40-200 20406080100120 ta [c] tpoff [ns] 0.4 0.8 1.2 1.6 2.0 -40-200 20406080100120 ta [c] ronl [ ] figure 36. out1 on resistance (sink) figure 37. proout on resistance figure 38. turn on time figure 39. turn off time 0.4 0.8 1.2 1.6 2.0 -40-200 20406080100120 ta [c] ronpro [ ] 100 120 140 160 180 200 -40-20 0 20406080100120 ta [c] tpon [ns] vcc2=14v vcc2=15v vcc2=20v vcc2=14v vcc2=15v vcc2=20v vcc2=14v vcc2=15v vcc2=20v vcc2=14v vcc2=15v vcc2=20v
19/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 figure 40. rise time (10000pf between out1-gnd2) figure 41. fall time (10000pf between out1-gnd2) figure 42. out2 on resistance (source) figure 43. out2 on resistance (sink) 25 50 75 100 14 16 18 20 vcc2 [v] trise [ns] ta=25c ta=-40c ta=125c 25 50 75 100 14 16 18 20 vcc2 [v] tfall [ns] ta=125c ta=25c ta=-40c 5.0 7.5 10.0 12.5 15.0 17.5 20.0 -40-200 20406080100120 ta [c] ron2h [ ] 1.5 4.0 6.5 -40-200 20406080100120 ta [c] ron2l [ ] vcc2=14v vcc2=15v vcc2=20v vcc2=14v vcc2=15v vcc2=20v
20/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 1.8 1.9 2.0 2.1 2.2 -40-200 20406080100120 ta [c] vout2on [v] figure 44. out2 on threshold voltage figure 45. out2 output delay time figure 46. vcc1 uvlo on/off voltage 0 20 40 60 80 14 16 18 20 vcc2 [v] tout2on [ns] ta=125c ta=25c ta=-40c figure 47. vcc1 uvlo mask time 0 1 2 3 4 5 3.95 4.05 4.15 4.25 4.35 4.45 vcc1 [v] flt [v] ta=125c ta=-40c ta=25c ta=25c ta=-40c ta=125c 2 6 10 14 18 22 26 30 -40-200 20406080100120 ta [c] tuvlo1msk [s] vcc2=20v vcc2=15v vcc2=14v
21/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 figure 48. vcc2 uvlo on/off voltage (at vcc1=5v) figure 49. vcc2 uvlo mask time figure 50. scp offset voltage (at scpth=0.7v) figure 51. scp detection mask time -10 -8 -6 -4 -2 0 2 4 6 8 10 14 16 18 20 vcc2 [v] vscdet [mv] ta=25c ta=-40c ta=125c 2.10 2.40 2.70 3.00 3.30 3.60 3.90 14 16 18 20 vc c2 [ v] tscpmsk [s] 0 1 2 3 4 5 6 10.5 11.5 12.5 13.5 vcc2 [v] flt [v] ta=125c ta=25c ta=-40c ta=-40c ta=25c ta=125c 2 6 10 14 18 22 26 30 -40-200 20406080100120 ta [c] tuvlo2msk [s] ta=-40c ta=125c ta=25c
22/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 figure 52. soft turn off release time figure 53. vts offset voltage (at vtsth=1.7v) -7.0 -5.0 -3.0 -1.0 1.0 3.0 5.0 7.0 14 16 18 20 vcc2 [v] vtsdet [mv] figure 54. thermal detection mask time figure 55. flt output low voltage (iflt=5ma) 2 6 10 14 18 22 26 30 14 16 18 20 vcc2 [v] ttsmsk [s] ta=125c ta=25c ta=-40c 0.0 0.1 0.2 0.3 0.4 4.50 4.75 5.00 5.25 5.50 vcc2 [v] vfltl [v] 30 50 70 90 110 -40-20 0 20406080100120 ta [c] tsto [s] vcc2=14v vcc2=15v vcc2=20v max. min. vcc2=14v vcc2=15v vcc2=20v ta=25c ta=125c ta=-40c ta=-40c ta=125c ta=25c
23/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 figure 56. fltrls threshold 2.78 2.99 3.20 3.41 3.62 4.50 4.75 5.00 5.25 5.50 vcc1 [v] vtfltrls [v] ta=-40c ta=25c ta=125c
24/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 selection of components externally connected r flt rls c flt rls out1 vtsin nc gnd1 gnd1 ina timer timer uvlo fltrls vcc1 test gnd2 mask out2 scpin flt vcc2 logic s r q proout gnd2 pre driver mask mask mask fb c vcc1 c vcc2 flt ena ecu inb vtsth mask logic mask flt sens or uvlo scpth - + figure 57. for using 4-pin igbt (for using scp function) figure 58. for using 3-pin igbt (for using desat function) recommended rohm mcr03ezp recommended rohm mcr03ezp recommended rohm mcr03ezp recommended rohm rsr025n03 rss065n03 recommended rohm mcr03ezp recommended rohm rsr025n03 rss065n03 r flt rls c flt rls out1 vtsin nc gnd1 gnd1 ina timer timer uvlo fltrls vcc1 test gnd2 out2 scpin vcc2 logic s r q proout gnd2 mask fb c vcc1 c vcc2 flt ena ecu inb vtsth mask logic mask flt sens or scpth mask flt mask mask uvlo pre driver - +
25/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 i/o equivalence circuits pin no. name i/o equivalence circuits function 1 vtsin vcc2 gnd2 vts in internal power suplly vtsth thermal detection pin 3 vtsth thermal detection threshold setting pin 4 scpth vc c 2 internal power suplly scpth scpin gnd2 short current detection threshold setting pin 5 scpin short current detection pin 6 out2 out2 gnd2 vc c 2 mos fet control pin for miller clamp 8 out1 out1 gnd2 vc c 2 output pin 10 proout proout gnd2 vc c 2 soft turn-off pin
26/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 pin no. name i/o equivalence circuits function 14 fltrls fltrls gnd1 vc c 1 fault output holding time setting pin 16 flt flt gnd1 vc c 1 fault output pin 13 inb ina inb ena gnd1 vc c 1 invert / non-invert selection pin 17 ina control input pin 18 ena input enabling signal input pin 19 test test gnd1 vc c 1 test mode setting pin
27/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 power dissipation thermal design please confirm that the ic?s chip temperature tj is not ov er 150c, while considering the ic?s power consumption (w), package power (pd) and ambient temperature (ta). when tj= 150c is exceeded the functions as a semiconductor do not operate and some problems (ex. abnormal operation of various parasitic elements and increasing of leak current) occur. constant use under these circumstances leads to deterioration a nd eventually ic may destruct. tjmax=150c must be strictly obeyed under all circumstances. figure 59. ssop-b20w derating curve 0 25 50 75 100 125 150 0 0.5 1.0 1.5 1.19 w 0 25 50 75 100 125 150 0 0.5 1.0 1.5 a mbient temperature: ta[c] power dissipation:pd [w] measurement machine th156 kuwano electric measurement condition rohm board board size 70 70 1.6mm 3 1-layer board ja =105.3c/w
28/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and s upply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of t he pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give s pecial consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground t he ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
29/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 operational notes ? continued 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 60. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others.
30/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 ordering information b m 6 1 0 2 f v -ce 2 part number package fv: ssop-b20w rank c:automotive packaging and forming specification e2: embossed tape and reel marking diagram ssop-b20w(top view) bm6102 part number marking lot number 1pin mark
31/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 physical dimension, tape and reel information package name ssop-b20w ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin
32/32 datasheet datasheet BM6102FV-C tsz02201-0818abh00110-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ?15 ? 001 23.jan.2014 rev.001 revision history date revision changes 23.jan.2014 001 new release
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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